Jaisung Lee, : rechercher sur Z-Library

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1

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - THB reliability research for fine pitch substrate

Weiwei Feng,, Zhou, Jianwei, Xingming Fu,, Qian Wang,, Jaisung Lee,

Année:

2009

Langue:

english

Fichier:

PDF, 9.11 MB

english, 2009

2

Human-centered designs, characteristics of urban streets, and pedestrian perceptions

Choi, Jaisung, Kim, Sangyoup, Min, Dongchan, Lee, Dongmin, Kim, Sungkyu

Journal:

Journal of Advanced Transportation

Année:

2016

Langue:

english

Fichier:

PDF, 1.46 MB

english, 2016

3

Safety effects of highway terrain types in vehicle crash model of major rural roads

Jaisung Choi, Sangyoup Kim, Tae-Young Heo, Jeomho Lee

Journal:

KSCE Journal of Civil Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 891 KB

english, 2011

4

Bayesian approach with the power prior for road safety analysis

Lee, Soobeom, Choi, Jaisung, Kim, Seong W.

Journal:

Transportmetrica

Année:

2010

Langue:

english

Fichier:

PDF, 169 KB

english, 2010

5

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Reliability of Au-Ag alloy wire bonding

Liu, Hai, Chen, Qi, Zhao, Zhenqing, Wang, Qian, Zeng, Jianfeng, Chae, Jonghyun, Lee, Jaisung

Année:

2010

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2010

6

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The effect of strain rate and strain range on bending fatigue test

Minyi Lou,, Long Wen,, Zhengrong Chen,, Jianwei Zhou,, Qian Wang,, Jaisung Lee,

Année:

2008

Langue:

english

Fichier:

PDF, 2.39 MB

english, 2008

7

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Investigation on TSOP warpage mechanism and improvement method

Lei Wang,, Zhenqing Zhao,, Jianhui Wang,, Long Wen,, Qian Wang,, Jaisung Lee,

Année:

2009

Langue:

english

Fichier:

PDF, 7.57 MB

english, 2009

8

Models and algorithm for stochastic network designs

Chen, Anthony, Kim, Juyoung, Lee, Seungjae, Choi, Jaisung

Journal:

Tsinghua Science & Technology

Année:

2009

Langue:

english

Fichier:

PDF, 256 KB

english, 2009

9

A Study on Appropriate length of Passing Lane in Consideration of Traffic Characteristics of Two-Lane Roads in South Korea

YoungRok. Kim, SukKi. Lee, JaePil. Moon, JunHwa. Jeong, JaiSung. Choi

Journal:

Procedia - Social and Behavioral Sciences

Année:

2012

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2012

10

Model of Volume-Delay Formula to assess travel time savings of underground tunnel roads

Kim, Sangyoup, Choi, Jaisung, Lee, Dongmin, Jang, Taeyoun

Journal:

KSCE Journal of Civil Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 504 KB

english, 2014

11

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Characterize the microstructure and reliability of ultra fine pitch BGA joints

Wang, Lei, Zhao, Zhenqing, Wang, Qian, Lee, Jaisung

Année:

2009

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2009

12

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study of isothermal bending fatigue test

Lou, Minyi, Wen, Long, Chen, Zhengrong, Zhou, Jianwei, Wang, Qian, Lee, Jaisung

Année:

2009

Langue:

english

Fichier:

PDF, 2.51 MB

english, 2009

13

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Board Level Cyclic Bending Test for MCP Package

Jing, Zhang, Hai, Liu, Lee, Jaisung

Année:

2007

Langue:

english

Fichier:

PDF, 254 KB

english, 2007

14

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Wire bonding performance and solder joint reliability investigation on ENEPIG finish substrate

Li Juanjuan,, Zhao Zhenqing,, Jaisung Lee,

Année:

2010

Langue:

english

Fichier:

PDF, 929 KB

english, 2010

15

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Replace ball attach by developing substrate solder bumping for 0.5mm pitch FBGA

Lei Wang,, Zhenqing Zhao,, Jiangtao Liu,, Jaisung Lee,

Année:

2010

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2010

16

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Pad finish related board-level solder joint reliability research

Chen Zhengrong,, Zhou Jianwei,, Fu Xingming,, Lee Jaisung,

Année:

2010

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2010

17

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Investigation of package warpage effect on TC solder joint reliability

Jianhui Wang,, Long Wen,, Jianwei Zhou,, Jaisung Lee,

Année:

2010

Langue:

english

Fichier:

PDF, 1.49 MB

english, 2010

18

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - System level drop reliability method research for netbook memory module

Lou, Minyi, Zhou, Jianwei, Wen, Long, Feng, Weiwei, Lee, Jaisung

Année:

2010

Langue:

english

Fichier:

PDF, 1.49 MB

english, 2010

19

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The influence of low level doping of Ni on the microstructure and reliability of SAC solder joint

Zhenqing Zhao,, Lei Wang,, Xiaoqiang Xie,, Qian Wang,, Jaisung Lee,

Année:

2008

Langue:

english

Fichier:

PDF, 3.39 MB

english, 2008

20

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Dynamic properties testing of solders and modeling of electronic packages subjected to drop impact

Long Wen,, Xingming Fu,, Jianwei Zhou,, Qian Wang,, Jaisung Lee,

Année:

2008

Langue:

english

Fichier:

PDF, 1.80 MB

english, 2008

21

[American Society of Civil Engineers Second International Conference on Transportation Information and Safety - Wuhan, China (June 29-July 2, 2013)] ICTIS 2013 - Driving Behaviors, the Brainwave Test, and the Distribution of Superelevation and Side Friction Factors for the SMART Highway

Choi, Jaisung, Kim, Sangyoup, Jeong, Seungwon, Lee, Dongmin, Jin, Minsu

Langue:

english

Fichier:

PDF, 861 KB

english